SPI (Solder Paste Inspection)

We have introduced industry-leading Sinic-tek SPI (Solder Paste Inspection)equipment, which multiple inspection precision modes ranges from 2.8μm to20μm. The outstanding function of the machine, telecentric lens staticcompensation, can effectively eliminate the measurement errors caused bysubstrate warpage.

Good precision makes it perfectly suited for Mini-LED, Micro-LED, andhigh-density interconnect (HDI) boards. It can inspect pads forultra-miniature components, such as 01005 and even 008004.The repeatability can reach 1μm.

When dealing with small components and high-density BGA packages,our AOI leverages a combination of high-resolution cameras andmulti-angle lighting to clearly capture the intricate details ofsolder joints.

It enables millisecond-level detection for defects, including:

• Cold joints
• Solder bridges
• Solder balls
• Component misalignment
• Tombstoning
• Reversed polarity

X-Ray Testing

Shuttle Star X-ray machine systems offer exceptional resolution.It leverages high-energy electrons to generate X-rays. Minute solderjoint defects can be found, such as cold joints, false joints,shorts, missing solder balls, and internal voids.

Fly Probe Testing

KnownPCBA leverages flying probe testing equipment to effectivelydetect various SMT process defects, such as cold solder joints atBGA edges, minute solder bridges between pins, component tombstoning,and jumper misalignments. This micron-level precision ensure stablequality very much.

The high quality of component performance also rely on our automativefly probe testing. For instance, it can precisely measure the specificvalues of components. For example, the resistors ranging from 1Ω to 1GΩ,capacitors (range: 10pF–1F), and inductors, as well as the electricalcharacteristics of active devices like diodes and MOSFETs(Metal-Oxide-Semiconductor Field-Effect Transistors).