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DIP Assembly

DIP ASSEMBLY

Our DIP Capability Overview

Ensure Big Component Mechanical Fixation

It is a guarantee of reliability. DIP assembly effectively supports the mounting of odd-shaped components, high-power parts, and large-size connectors.

These components often play critical roles in power conversion and mechanical stability, while SMT processes cannot efficiently handle them.

Get SMT&DIP Engineering Support

DIP Assembly
DIP Assembly
DIP Assembly

DIP ASSEMBLY

Automated Wave Soldering

The process after DIP is wave soldering. It can achieve high-efficiency, highly consistent, and low-defect mass soldering.

Our DIP machine features high-precision parameter control. The preheating temperatures can be regulated from 100 to 150°C precisely. The adjustment range of solder wave height is 1/2 to 2/3 of the PCB thickness). And the conveyor inclination (approximately 3.5°), and chain speed can also be controlled.

This helps balance solder joint wetting time and thermal shock. It can prevent defects such as cold joints and solder bridging.

DIP Assembly

100-150°C

Preheating Temperature

1/2 - 2/3

Solder Wave Height

≈3.5°

Conveyor Inclination

Adjustable

Chain Speed Control

Balanced solder joint wetting time and thermal shock.It can prevent defects such as cold joints and solder bridging.

Selective Soldering Technology

Our selective soldering can prevent heat damage to adjacent surface-mount components and resolves soldering challenges associated with irregularly shaped components (such as relays and large capacitors). It is used to solder only specific joints for high-density boards or localized soldering requirements.

DIP Assembly
01 /
Prevent heat damage to adjacent surface-mount components
02 /
Solve soldering challenges for irregular components
03 /
Solder only specific joints for high-density boards

Quality Assurance of DIP

Manual operation does not mean low standards. Our manual DIP processes features the rigorous quality management system. Our soldering operators undergo strict training and certification before commencing work. Their good regular skills competitions and quality awareness can ensure standardized operations.

We also have multi-stage inspection during DIP process. Strict IPQC patrols are conducted to monitor soldering temperature and duration in real-time. AOI can supplement manual visual inspection to detect common defects such as cold joints, solder bridges, and reversed polarity to achieve a detection rate exceeding 99.8%.

And our ICT and FCT can ensure good quality of every circuit board before shipment.

DIP Assembly
Operations Center

Shenzhen KnownPCBA Technology Co.,Ltd

Bldg D,Liantangkeng Industrial Area,Qianjin Road,Xixiang Street,Bao'an Dist.,Shenzhen City,Guangdong Province,518102,China.

DIP Assembly Tel:

+86 755 2794 4155

DIP Assembly Fax:

+86 755 2794 4159

DIP Assembly E-mail:

sales@knownpcba.com

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