Short Lead Time, Design Guide and Quality Assurance

A complete quality control system covering design verification, material inspection, manufacturing process control and final testing.

Conduct a manufacturability review of Gerber files, BOM, and coordinates before production. Identify risks such as pad spacing, impedance matching, and test point coverage, thereby preventing batch issues at the source.

Implement IQC to verify authenticity and solderability of components. 3D SPI monitors solder paste volume. AOI inspects placement deviation, standoff and solder bridging. X-Ray detects internal voids and solder shorting in BGA or QFN.

Conduct electrical connectivity checks and functional tests including power-on, signal reading and writing, and boundary condition simulation.

Establish production data archives including oven temperature curves, inspection images and material batches for precise problem tracing.